DF37C-50DP-0.4V(51)
Hirose Electric Co Ltd
Hirose Electric Co Ltd
CONN HDR 50POS SMD GOLD
$0.94
Available to order
Reference Price (USD)
1+
$0.93800
500+
$0.92862
1000+
$0.91924
1500+
$0.90986
2000+
$0.90048
2500+
$0.8911
Exquisite packaging
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Hirose Electric Co Ltd DF37C-50DP-0.4V(51) is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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DF37C-50DP-0.4V(51)
$0.94
Product details
The DF37C-50DP-0.4V(51) from Hirose Electric Co Ltd represents a premium edge-type mezzanine connector solution for critical board-to-board applications. This rectangular array connector delivers exceptional signal integrity and power transmission in compact electronic assemblies. Its advanced contact geometry ensures reliable connections in medical imaging systems, semiconductor test equipment, and industrial control units. The connector's robust construction withstands mechanical stress in transportation and aerospace electronics. Features include enhanced current-carrying capacity, optimized contact resistance, and vibration-resistant mating interfaces. The DF37C-50DP-0.4V(51) supports high-speed data transmission while maintaining excellent EMI/RFI shielding characteristics. Its modular design allows flexible configuration for different stack heights and pin counts. Common implementations include server backplane connections, power supply modules, and instrumentation clusters. The connector's durable materials ensure long-term reliability in challenging operating environments. For technical specifications and application support regarding this high-performance interconnect solution, please complete our online inquiry form.
General specs
- Product Status: Active
- Connector Type: Header, Outer Shroud Contacts
- Number of Positions: 50
- Pitch: 0.016" (0.40mm)
- Number of Rows: 2
- Mounting Type: Surface Mount
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 2.00µin (0.051µm)
- Mated Stacking Heights: 0.98mm
- Height Above Board: 0.030" (0.75mm)
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