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BK13C06-40DS/2-0.35V(895)

Hirose Electric Co Ltd
BK13C06-40DS/2-0.35V(895) Preview
Hirose Electric Co Ltd
CONN RCPT 0.35MM SMD 40POS
$1.47
Available to order
Reference Price (USD)
1+
$1.47000
500+
$1.4553
1000+
$1.4406
1500+
$1.4259
2000+
$1.4112
2500+
$1.3965
Exquisite packaging
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Hirose Electric Co Ltd BK13C06-40DS/2-0.35V(895) is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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BK13C06-40DS/2-0.35V(895)

BK13C06-40DS/2-0.35V(895)

$1.47

Product details

Hirose Electric Co Ltd's BK13C06-40DS/2-0.35V(895) represents an advanced edge-type mezzanine connector solution for high-density board-to-board connections. This rectangular array connector delivers exceptional electrical performance in compact electronic systems. The innovative contact design ensures low insertion loss and minimal signal distortion across high-speed data channels. With its precision-molded housing and optimized contact geometry, the BK13C06-40DS/2-0.35V(895) achieves reliable connections even in vibration-prone environments. The connector features a secure latching mechanism that maintains positive engagement throughout product lifespan. Typical implementations include military avionics systems, test and measurement equipment, and industrial robotics control units. Its space-saving profile enables efficient PCB stacking in rack-mounted server applications. The BK13C06-40DS/2-0.35V(895) supports both power and signal transmission in mixed-use configurations. For engineers seeking reliable inter-board connectivity solutions, this connector series offers versatile implementation options. Contact our sales team via the website inquiry form to discuss your specific application requirements.

General specs

  • Product Status: Active
  • Connector Type: Receptacle, Center Strip Contacts
  • Number of Positions: 40
  • Pitch: 0.014" (0.35mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Solder Retention
  • Contact Finish: Gold
  • Contact Finish Thickness: 1.97µin (0.050µm)
  • Mated Stacking Heights: 0.6mm
  • Height Above Board: 0.022" (0.57mm)

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