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BK13C06-32DP/2-0.35V(800)

Hirose Electric Co Ltd
BK13C06-32DP/2-0.35V(800) Preview
Hirose Electric Co Ltd
CONN HDR 0.35MM SMD 32POS
$0.56
Available to order
Reference Price (USD)
1+
$0.56000
500+
$0.5544
1000+
$0.5488
1500+
$0.5432
2000+
$0.5376
2500+
$0.532
Exquisite packaging
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Hirose Electric Co Ltd BK13C06-32DP/2-0.35V(800) is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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BK13C06-32DP/2-0.35V(800)

BK13C06-32DP/2-0.35V(800)

$0.56

Product details

The BK13C06-32DP/2-0.35V(800) rectangular array connector by Hirose Electric Co Ltd provides superior edge-type mezzanine connectivity for advanced electronic systems. Designed for board-to-board applications, this high-density solution ensures reliable signal transmission and power delivery. Its innovative contact design maintains stable electrical characteristics in industrial robotics, process control equipment, and test measurement systems. The connector's robust construction withstands harsh environmental conditions encountered in transportation and energy applications. Features include enhanced EMI shielding, vibration-resistant mating interfaces, and optimized current-carrying capacity. The BK13C06-32DP/2-0.35V(800) supports various stack heights between parallel boards, offering design flexibility for different system architectures. Its space-saving profile facilitates thermal management in densely packed electronic assemblies. Common implementations include server backplanes, power supply modules, and instrumentation clusters. For OEMs requiring consistent interconnect performance, this solution offers reliable alternatives to conventional board stacking methods. Submit your project requirements through our online inquiry system to receive customized connector recommendations.

General specs

  • Product Status: Active
  • Connector Type: Plug, Outer Shroud Contacts
  • Number of Positions: 32
  • Pitch: 0.014" (0.35mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Solder Retention
  • Contact Finish: Gold
  • Contact Finish Thickness: 1.97µin (0.050µm)
  • Mated Stacking Heights: 0.6mm
  • Height Above Board: 0.019" (0.48mm)

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