103-016-253-200

Engineered for excellence, the 103-016-253-200 backplane connector contact by EDAC Inc. delivers unmatched reliability in high-density interconnect systems. These contacts are perfect for applications requiring precision and longevity, ensuring seamless data and power transfer across multiple boards. The 103-016-253-200 is designed to meet the rigorous demands of modern electronic systems. **Product Features**: The 103-016-253-200 boasts a multi-finger contact design for optimal current carrying capacity and low insertion force. Its high-temperature-resistant material ensures stable performance in extreme conditions. The contact's self-cleaning feature maintains conductivity over repeated mating cycles, reducing maintenance needs. Additionally, it offers excellent EMI shielding to protect sensitive signals. **Applications**: 1) Data center servers and storage systems. 2) Medical imaging equipment requiring high-speed data transfer. 3) Automotive electronics for infotainment and control systems. **Call to Action**: Upgrade your interconnect solutions with the 103-016-253-200. Request a quote now or visit our website to explore how this contact can enhance your application's reliability and efficiency.