SF500-265005
CUI Devices

CUI Devices
THERMAL INTERFACE MATERIAL, SF50
$24.81
Available to order
Reference Price (USD)
4+
$26.00750
Exquisite packaging
Discount
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EMS | 3-7 days |
CUI Devices SF500-265005 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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Product details
Enhance your thermal management with the SF500-265005 from CUI Devices, a high-quality thermal pad designed for efficient heat transfer. This thermal pad is perfect for applications requiring reliable thermal conductivity and electrical insulation. Its innovative design ensures optimal performance in a variety of electronic devices, making it a versatile solution for engineers and designers.\n\nThe SF500-265005 boasts excellent conformability, allowing it to fill gaps and irregularities on surfaces for maximum heat dissipation. It is resistant to high temperatures and mechanical stress, ensuring durability in demanding environments. The pad is also non-toxic and safe for use in sensitive applications, providing peace of mind for users.\n\nCommon applications include use in medical devices, aerospace systems, and renewable energy solutions. In medical devices, it helps maintain safe operating temperatures for sensitive equipment. For aerospace systems, it provides reliable thermal management in extreme conditions. In renewable energy, it enhances the efficiency of solar panels and wind turbines.\n\nDon't miss out on the benefits of the SF500-265005. Submit an inquiry now to get more information and pricing details. Our team is available to assist you with any questions and help you choose the right thermal pad for your needs.
General specs
- Product Status: Active
- Usage: -
- Type: Pad, Sheet
- Shape: Rectangular
- Outline: 26.00mm x 50.00mm
- Thickness: 0.0197" (0.500mm)
- Material: Silicone Elastomer
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Blue
- Thermal Resistivity: -
- Thermal Conductivity: 3.0W/m-K