HSE08-505028
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
$2.46
Available to order
Reference Price (USD)
1+
$2.46000
500+
$2.4354
1000+
$2.4108
1500+
$2.3862
2000+
$2.3616
2500+
$2.337
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
| DHL / Fedex / UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
CUI Devices HSE08-505028 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
Experience hassle-free transactions with our flexible payment options and credit facilities. Learn more about the various payment methods accepted, installment plans, and any exclusive credit offers available to make your shopping experience seamless.
HSE08-505028
$2.46
Product details
General specs
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-218, TO-220
- Attachment Method: Clip
- Shape: Rectangular, Angled Fins
- Length: 1.969" (50.00mm)
- Width: 1.102" (28.00mm)
- Diameter: -
- Fin Height: 1.969" (50.00mm)
- Power Dissipation @ Temperature Rise: 10.53W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM
- Thermal Resistance @ Natural: 7.13°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
Viewed products
