HSB11-252518
CUI Devices
CUI Devices
HEAT SINK, BGA, 25 X 25 X 18 MM
$1.28
Available to order
Reference Price (USD)
1+
$1.28000
500+
$1.2672
1000+
$1.2544
1500+
$1.2416
2000+
$1.2288
2500+
$1.216
Exquisite packaging
Discount
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| TNT | 2-6 days |
| EMS | 3-7 days |
CUI Devices HSB11-252518 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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HSB11-252518
$1.28
Product details
General specs
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.984" (25.00mm)
- Width: 0.984" (25.00mm)
- Diameter: -
- Fin Height: 0.709" (18.00mm)
- Power Dissipation @ Temperature Rise: 5.5W @ 75°C
- Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 13.70°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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