Shopping cart

Subtotal: $0.00

HSB09-212115

CUI Devices
HSB09-212115 Preview
CUI Devices
HEAT SINK, BGA, 21 X 21 X 15 MM
$0.93
Available to order
Reference Price (USD)
1+
$0.93000
500+
$0.9207
1000+
$0.9114
1500+
$0.9021
2000+
$0.8928
2500+
$0.8835
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram

DHL / Fedex / UPS 2-5 days
TNT 2-6 days
EMS 3-7 days

CUI Devices HSB09-212115 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

Experience hassle-free transactions with our flexible payment options and credit facilities. Learn more about the various payment methods accepted, installment plans, and any exclusive credit offers available to make your shopping experience seamless.
HSB09-212115

HSB09-212115

$0.93

Product details

The HSB09-212115 from CUI Devices is a high-efficiency thermal heat sink designed to provide exceptional cooling for a wide range of applications. Its advanced design ensures optimal heat dissipation, making it ideal for use in high-power electronics, industrial machinery, and more. The HSB09-212115 excels in environments where temperature control is critical, offering reliable performance and durability. Its innovative fin design enhances airflow and heat transfer, ensuring efficient cooling even under heavy loads. Industries such as automotive, aerospace, and telecommunications can benefit from its superior thermal management capabilities. In the automotive sector, it is perfect for cooling electric vehicle components, while in aerospace, it ensures the reliability of avionics systems. Telecommunications equipment also benefits from its ability to maintain stable temperatures in base stations and networking gear. CUI Devices has engineered this heat sink to meet the highest industry standards, ensuring long-lasting performance and reliability. Its versatile design allows for easy integration into various systems, making it a cost-effective solution for thermal management. For businesses looking to enhance their cooling strategies, the HSB09-212115 offers a proven solution backed by CUI Devices's expertise. Don't let heat-related issues impact your operations reach out to us today to request a quote and learn how this heat sink can benefit your application.

General specs

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 0.827" (21.00mm)
  • Width: 0.827" (21.00mm)
  • Diameter: -
  • Fin Height: 0.591" (15.00mm)
  • Power Dissipation @ Temperature Rise: 4.3W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 17.39°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

Viewed products

Advanced Thermal Solutions Inc.

ATS-20B-197-C2-R0

$0.00 (not set)
Advanced Thermal Solutions Inc.

ATS-14B-110-C2-R1

$0.00 (not set)
Advanced Thermal Solutions Inc.

ATS-05A-03-C3-R0

$0.00 (not set)
Advanced Thermal Solutions Inc.

ATS-07C-79-C2-R0

$0.00 (not set)
Advanced Thermal Solutions Inc.

ATS-12B-72-C1-R0

$0.00 (not set)
Advanced Thermal Solutions Inc.

ATS-21H-197-C1-R0

$0.00 (not set)
Advanced Thermal Solutions Inc.

ATS-04E-19-C3-R0

$0.00 (not set)
Advanced Thermal Solutions Inc.

ATS-01E-36-C3-R0

$0.00 (not set)
Advanced Thermal Solutions Inc.

ATS-08C-131-C2-R0

$0.00 (not set)
Advanced Thermal Solutions Inc.

ATS-21G-162-C1-R0

$0.00 (not set)
Top