HSB07-202009
CUI Devices
CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
$0.58
Available to order
Reference Price (USD)
1+
$0.58140
500+
$0.575586
1000+
$0.569772
1500+
$0.563958
2000+
$0.558144
2500+
$0.55233
Exquisite packaging
Discount
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| DHL / Fedex / UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
CUI Devices HSB07-202009 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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HSB07-202009
$0.58
Product details
General specs
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.787" (20.00mm)
- Width: 0.787" (20.00mm)
- Diameter: -
- Fin Height: 0.354" (9.00mm)
- Power Dissipation @ Temperature Rise: 3.1W @ 75°C
- Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM
- Thermal Resistance @ Natural: 24.08°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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