TC1-200G
Chip Quik Inc.
Chip Quik Inc.
HEAT SINK COMPOUND - HIGH DENSIT
$49.95
Available to order
Reference Price (USD)
1+
$49.95000
Exquisite packaging
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| EMS | 3-7 days |
Chip Quik Inc. TC1-200G is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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TC1-200G
$49.95
Product details
The TC1-200G from Chip Quik Inc. is a high-efficiency thermal paste tailored for optimal heat transfer in thermal management systems. As part of the Thermal - Adhesives, Epoxies, Greases, Pastes lineup, this paste fills microscopic imperfections between surfaces to maximize thermal conductivity. The TC1-200G is non-curing, ensuring consistent performance over time without hardening. Its smooth texture allows for effortless application and even coverage, reducing thermal resistance.
This thermal paste excels in high-temperature environments, maintaining stability under thermal cycling. It is electrically non-conductive, preventing short circuits in electronic applications. The paste s resistance to drying and pump-out ensures long-lasting reliability. Whether for consumer electronics or industrial machinery, the TC1-200G delivers superior thermal management.
Applications include: 1) CPU and GPU cooling in gaming systems, 2) Thermal management in solar inverters, and 3) Heat dissipation in electric vehicle components. The TC1-200G is a preferred choice for engineers seeking peak performance.
Boost your thermal efficiency with the TC1-200G. Get in touch with Chip Quik Inc. today for product details and purchasing options. Our experts are ready to assist you in finding the perfect thermal solution.
General specs
- Product Status: Active
- Type: Silicone Compound
- Size / Dimension: 200 gram Jar
- Usable Temperature Range: -
- Color: White
- Thermal Conductivity: 0.67W/m-K
- Features: -
- Shelf Life: 60 Months
- Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
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