AR 32-HZL/07-TT
Assmann WSW Components

Assmann WSW Components
CONN IC DIP SOCKET 32POS GOLD
$1.44
Available to order
Reference Price (USD)
1+
$1.44167
500+
$1.4272533
1000+
$1.4128366
1500+
$1.3984199
2000+
$1.3840032
2500+
$1.3695865
Exquisite packaging
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Assmann WSW Components AR 32-HZL/07-TT is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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Product details
Discover the engineering excellence of the AR 32-HZL/07-TT from Assmann WSW Components, a high-reliability socket solution for ICs and transistors. This socket features a unique dual-contact system that ensures redundant connectivity, significantly reducing the risk of connection failures. Its advanced material composition provides excellent thermal conductivity, helping to dissipate heat from sensitive components. The AR 32-HZL/07-TT is particularly effective in power management applications, LED lighting systems, and electric vehicle components where stable connections are paramount. The socket's intuitive design includes alignment guides and positive locking mechanisms for error-proof installation. Withstanding harsh industrial environments while maintaining signal integrity, this product demonstrates Assmann WSW Components's commitment to quality and innovation. Military-grade versions are available for defense applications requiring extra durability. The AR 32-HZL/07-TT represents a smart choice for engineers prioritizing performance, longevity, and ease of use in their interconnect solutions. Ready to incorporate this superior socket into your designs? Contact our technical sales team today for personalized assistance and competitive pricing.
General specs
- Product Status: Active
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Polyester
- Operating Temperature: -40°C ~ 105°C