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AR 24-HZL/07-TT

Assmann WSW Components
AR 24-HZL/07-TT Preview
Assmann WSW Components
CONN IC DIP SOCKET 24POS GOLD
$1.09
Available to order
Reference Price (USD)
1+
$1.09242
500+
$1.0814958
1000+
$1.0705716
1500+
$1.0596474
2000+
$1.0487232
2500+
$1.037799
Exquisite packaging
Discount
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DHL / Fedex / UPS 2-5 days
TNT 2-6 days
EMS 3-7 days

Assmann WSW Components AR 24-HZL/07-TT is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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AR 24-HZL/07-TT

AR 24-HZL/07-TT

$1.09

Product details

The AR 24-HZL/07-TT by Assmann WSW Components is a versatile socket solution tailored for ICs and transistors, offering unmatched flexibility and performance. Designed with precision in mind, this socket ensures perfect alignment and contact with your components, eliminating connectivity issues. Its compact form factor makes it suitable for space-constrained applications without sacrificing functionality. The AR 24-HZL/07-TT boasts features like enhanced shock resistance, low contact resistance, and superior mating cycles, ensuring longevity in harsh conditions. Ideal for use in renewable energy systems, robotics, and defense electronics, this socket provides the reliability needed for mission-critical operations. Engineers appreciate its ease of integration and consistent performance across various operating temperatures. With Assmann WSW Components's reputation for excellence, the AR 24-HZL/07-TT is a smart investment for any high-tech application. Take the next step in optimizing your designs contact us today for more information and pricing details on this exceptional socket solution.

General specs

  • Product Status: Active
  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200.0µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Polyester
  • Operating Temperature: -40°C ~ 105°C

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