AR 08-HZW/TN
Assmann WSW Components
Assmann WSW Components
CONN IC DIP SOCKET 8POS GOLD
$1.47
Available to order
Reference Price (USD)
1+
$1.47000
500+
$1.4553
1000+
$1.4406
1500+
$1.4259
2000+
$1.4112
2500+
$1.3965
Exquisite packaging
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Assmann WSW Components AR 08-HZW/TN is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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AR 08-HZW/TN
$1.47
Product details
The AR 08-HZW/TN by Assmann WSW Components delivers precision connectivity for ICs and transistors in compact, high-density applications. This innovative socket features micro-precision contacts that maintain excellent electrical characteristics even after thousands of mating cycles. Its low-profile design makes it perfect for space-constrained applications in mobile devices, wearable technology, and miniaturized industrial controls. The AR 08-HZW/TN offers superior resistance to mechanical stress and thermal cycling, ensuring reliable performance in challenging conditions. Engineers appreciate its compatibility with automated assembly processes, reducing production time and costs. This socket finds ideal applications in smart home devices, portable medical equipment, and drone technology where size and reliability are critical factors. Assmann WSW Components's quality control processes guarantee consistent performance across all production batches, giving you peace of mind for your high-volume requirements. The AR 08-HZW/TN represents the perfect marriage of miniaturization and robustness in interconnect solutions. Don't let space limitations compromise your design explore how this advanced socket can solve your connectivity challenges. Request a quote today to start your evaluation process.
General specs
- Product Status: Active
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Polyester
- Operating Temperature: -40°C ~ 105°C
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