48-6554-10
Aries Electronics
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
$19.99
Available to order
Reference Price (USD)
1+
$14.55000
25+
$13.31080
100+
$11.98400
500+
$10.91400
Exquisite packaging
Discount
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Aries Electronics 48-6554-10 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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48-6554-10
$19.99
Product details
The 48-6554-10 by Aries Electronics sets new benchmarks for IC and transistor sockets, offering exceptional quality and innovative features. This socket's precision-machined contacts provide gas-tight connections, preventing oxidation and ensuring consistent electrical performance over time. Its modular design allows for customization to specific pin counts and configurations, catering to diverse application requirements. The 48-6554-10 demonstrates outstanding performance in high-vibration environments like railway systems, wind turbines, and heavy construction equipment. Additional highlights include lead-free construction for environmental compliance and optional burn-in capabilities for quality assurance. Professionals in the semiconductor testing, power electronics, and automation industries particularly value this socket's reliability and precision. Aries Electronics's rigorous testing protocols guarantee that every 48-6554-10 meets exacting standards before reaching your production line. Elevate your interconnect strategy with this superior socket solution reach out today for technical specifications and volume pricing options tailored to your project scope.
General specs
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 48 (2 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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