40-6554-10
Aries Electronics
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
$19.32
Available to order
Reference Price (USD)
1+
$14.58000
25+
$12.75760
100+
$11.29950
500+
$9.47700
1,000+
$9.11250
Exquisite packaging
Discount
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| EMS | 3-7 days |
Aries Electronics 40-6554-10 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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40-6554-10
$19.32
Product details
The 40-6554-10 by Aries Electronics is a versatile socket solution tailored for ICs and transistors, offering unmatched flexibility and performance. Designed with precision in mind, this socket ensures perfect alignment and contact with your components, eliminating connectivity issues. Its compact form factor makes it suitable for space-constrained applications without sacrificing functionality. The 40-6554-10 boasts features like enhanced shock resistance, low contact resistance, and superior mating cycles, ensuring longevity in harsh conditions. Ideal for use in renewable energy systems, robotics, and defense electronics, this socket provides the reliability needed for mission-critical operations. Engineers appreciate its ease of integration and consistent performance across various operating temperatures. With Aries Electronics's reputation for excellence, the 40-6554-10 is a smart investment for any high-tech application. Take the next step in optimizing your designs contact us today for more information and pricing details on this exceptional socket solution.
General specs
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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