24-6554-10
Aries Electronics
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
$13.33
Available to order
Reference Price (USD)
1+
$11.04000
25+
$9.60000
100+
$7.68000
500+
$6.48000
1,000+
$6.12000
Exquisite packaging
Discount
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Aries Electronics 24-6554-10 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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24-6554-10
$13.33
Product details
The 24-6554-10 from Aries Electronics is a high-performance socket designed for ICs and transistors, ensuring reliable electrical connections in demanding environments. This socket offers exceptional durability and precision, making it ideal for applications where consistent performance is critical. With its robust construction, the 24-6554-10 provides secure mounting and easy replacement of components, reducing downtime and maintenance costs. Whether you're working with industrial equipment or advanced electronics, this socket delivers the reliability you need. Key features include superior contact stability, resistance to environmental factors, and compatibility with a wide range of ICs and transistors. The 24-6554-10 is perfect for use in automotive electronics, telecommunications infrastructure, and industrial automation systems. Its versatile design ensures seamless integration into various circuit boards and assemblies. For engineers and procurement specialists seeking a dependable solution, the 24-6554-10 stands out as a top choice. Ready to enhance your project with this high-quality socket? Submit an inquiry today to learn more about pricing and availability.
General specs
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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