DILB32P-223TLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
CONN IC DIP SOCKET 32POS TINLEAD
$1.09
Available to order
Reference Price (USD)
1+
$0.48000
10+
$0.44600
25+
$0.40160
50+
$0.35720
100+
$0.34220
250+
$0.31248
500+
$0.29760
1,000+
$0.24552
2,500+
$0.22320
Exquisite packaging
Discount
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Amphenol ICC (FCI) DILB32P-223TLF is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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DILB32P-223TLF
$1.09
Product details
Discover the engineering excellence of the DILB32P-223TLF from Amphenol ICC (FCI), a high-reliability socket solution for ICs and transistors. This socket features a unique dual-contact system that ensures redundant connectivity, significantly reducing the risk of connection failures. Its advanced material composition provides excellent thermal conductivity, helping to dissipate heat from sensitive components. The DILB32P-223TLF is particularly effective in power management applications, LED lighting systems, and electric vehicle components where stable connections are paramount. The socket's intuitive design includes alignment guides and positive locking mechanisms for error-proof installation. Withstanding harsh industrial environments while maintaining signal integrity, this product demonstrates Amphenol ICC (FCI)'s commitment to quality and innovation. Military-grade versions are available for defense applications requiring extra durability. The DILB32P-223TLF represents a smart choice for engineers prioritizing performance, longevity, and ease of use in their interconnect solutions. Ready to incorporate this superior socket into your designs? Contact our technical sales team today for personalized assistance and competitive pricing.
General specs
- Product Status: Active
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 100.0µin (2.54µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 100.0µin (2.54µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyamide (PA), Nylon
- Operating Temperature: -55°C ~ 125°C
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