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DILB20P-223TLF

Amphenol ICC (FCI)
DILB20P-223TLF Preview
Amphenol ICC (FCI)
CONN IC DIP SOCKET 20POS TIN
$0.79
Available to order
Reference Price (USD)
1+
$0.37000
24+
$0.35083
48+
$0.30063
72+
$0.25556
120+
$0.24550
264+
$0.22045
504+
$0.21042
1,008+
$0.17535
2,520+
$0.16032
Exquisite packaging
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Amphenol ICC (FCI) DILB20P-223TLF is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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DILB20P-223TLF

DILB20P-223TLF

$0.79

Product details

Experience superior connectivity with the DILB20P-223TLF from Amphenol ICC (FCI), a high-grade socket specifically designed for ICs and transistors. This socket delivers exceptional electrical performance and mechanical stability, ensuring uninterrupted operation in even the most challenging environments. Its advanced contact technology guarantees low insertion force and high retention, protecting your components during installation and use. The DILB20P-223TLF stands out with its resistance to vibration, temperature fluctuations, and chemical exposure, making it suitable for automotive control systems, industrial machinery, and IoT devices. The socket's innovative design allows for quick component changes, significantly reducing assembly time. Backed by Amphenol ICC (FCI)'s quality assurance, the DILB20P-223TLF meets the highest industry standards for reliability and performance. Whether you're developing new products or maintaining existing systems, this socket offers the perfect balance of functionality and durability. Ready to source this essential component? Submit your inquiry now and our team will provide customized solutions for your specific requirements.

General specs

  • Product Status: Active
  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 100.0µin (2.54µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 100.0µin (2.54µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyamide (PA), Nylon
  • Operating Temperature: -55°C ~ 105°C

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