DILB18P-223TLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
CONN IC DIP SOCKET 18POS TINLEAD
$0.71
Available to order
Reference Price (USD)
1+
$0.33000
10+
$0.31500
26+
$0.26962
52+
$0.22923
104+
$0.22029
260+
$0.19777
520+
$0.18879
1,014+
$0.15733
2,522+
$0.14384
Exquisite packaging
Discount
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Amphenol ICC (FCI) DILB18P-223TLF is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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DILB18P-223TLF
$0.71
Product details
The DILB18P-223TLF by Amphenol ICC (FCI) sets new benchmarks for IC and transistor sockets, offering exceptional quality and innovative features. This socket's precision-machined contacts provide gas-tight connections, preventing oxidation and ensuring consistent electrical performance over time. Its modular design allows for customization to specific pin counts and configurations, catering to diverse application requirements. The DILB18P-223TLF demonstrates outstanding performance in high-vibration environments like railway systems, wind turbines, and heavy construction equipment. Additional highlights include lead-free construction for environmental compliance and optional burn-in capabilities for quality assurance. Professionals in the semiconductor testing, power electronics, and automation industries particularly value this socket's reliability and precision. Amphenol ICC (FCI)'s rigorous testing protocols guarantee that every DILB18P-223TLF meets exacting standards before reaching your production line. Elevate your interconnect strategy with this superior socket solution reach out today for technical specifications and volume pricing options tailored to your project scope.
General specs
- Product Status: Active
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 100.0µin (2.54µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 100.0µin (2.54µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyamide (PA), Nylon
- Operating Temperature: -55°C ~ 125°C
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