10138650-058202DLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
BERGSTAK HS 0.5MM BOARD-TO-BOARD
$8.22
Available to order
Reference Price (USD)
1+
$8.22000
500+
$8.1378
1000+
$8.0556
1500+
$7.9734
2000+
$7.8912
2500+
$7.809
Exquisite packaging
Discount
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| TNT | 2-6 days |
| EMS | 3-7 days |
Amphenol ICC (FCI) 10138650-058202DLF is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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10138650-058202DLF
$8.22
Product details
The 10138650-058202DLF rectangular array connector by Amphenol ICC (FCI) provides superior edge-type mezzanine connectivity for advanced electronic systems. Designed for board-to-board applications, this high-density solution ensures reliable signal transmission and power delivery. Its innovative contact design maintains stable electrical characteristics in industrial robotics, process control equipment, and test measurement systems. The connector's robust construction withstands harsh environmental conditions encountered in transportation and energy applications. Features include enhanced EMI shielding, vibration-resistant mating interfaces, and optimized current-carrying capacity. The 10138650-058202DLF supports various stack heights between parallel boards, offering design flexibility for different system architectures. Its space-saving profile facilitates thermal management in densely packed electronic assemblies. Common implementations include server backplanes, power supply modules, and instrumentation clusters. For OEMs requiring consistent interconnect performance, this solution offers reliable alternatives to conventional board stacking methods. Submit your project requirements through our online inquiry system to receive customized connector recommendations.
General specs
- Product Status: Active
- Connector Type: Plug, Outer Shroud Contacts
- Number of Positions: 50
- Pitch: 0.020" (0.50mm)
- Number of Rows: 2
- Mounting Type: Surface Mount
- Features: Board Guide, Pick and Place, Solder Retention
- Contact Finish: Gold
- Contact Finish Thickness: 5.00µin (0.127µm)
- Mated Stacking Heights: -
- Height Above Board: 0.421" (10.70mm)
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