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AS4C8M32MSA-6BIN

Alliance Memory, Inc.
AS4C8M32MSA-6BIN Preview
Alliance Memory, Inc.
IC DRAM 256MBIT PARALLEL 90FBGA
$7.96
Available to order
Reference Price (USD)
1+
$6.06000
10+
$5.52900
25+
$5.42360
50+
$5.38660
190+
$4.83211
380+
$4.81353
570+
$4.51305
1,140+
$4.32101
Exquisite packaging
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Alliance Memory, Inc. AS4C8M32MSA-6BIN is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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AS4C8M32MSA-6BIN

AS4C8M32MSA-6BIN

$7.96

Product details

Discover the AS4C8M32MSA-6BIN by Alliance Memory, Inc., a high-efficiency memory IC engineered for next-generation computing platforms. This innovative solution delivers superior performance metrics, combining speed, capacity, and power optimization in a single package. Its architecture is tailored for both embedded and expandable memory applications. The AS4C8M32MSA-6BIN features include dynamic frequency scaling, bank interleaving support, and thermal throttling capability. These advanced features enable optimal performance across various operating conditions. The memory IC offers excellent signal integrity at high speeds while maintaining low power consumption. Its design incorporates reliability enhancements for continuous operation. Ideal applications include hyperscale data centers, AI inference accelerators, and autonomous mobile robots. The AS4C8M32MSA-6BIN is equally effective in virtual reality systems, genomic sequencing equipment, and quantum computing interfaces. Its capabilities extend to smart agriculture systems and renewable energy management platforms requiring high-performance memory solutions. To learn more about integrating this Alliance Memory, Inc. memory IC into your design, submit your inquiry through our online portal. Our application engineers will provide technical support and procurement options for the AS4C8M32MSA-6BIN, ensuring optimal memory performance for your specific requirements.

General specs

  • Product Status: Active
  • Memory Type: Volatile
  • Memory Format: DRAM
  • Technology: SDRAM - Mobile
  • Memory Size: 256Mb (8M x 32)
  • Memory Interface: Parallel
  • Clock Frequency: 166 MHz
  • Write Cycle Time - Word, Page: 15ns
  • Access Time: 5.5 ns
  • Voltage - Supply: 1.14V ~ 1.95V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 90-VFBGA
  • Supplier Device Package: 90-FBGA (8x13)

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