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AS4C64M16D3B-12BIN

Alliance Memory, Inc.
AS4C64M16D3B-12BIN Preview
Alliance Memory, Inc.
IC DRAM 1GBIT PARALLEL 96FBGA
$7.75
Available to order
Reference Price (USD)
190+
$4.42258
380+
$4.40558
570+
$4.13060
1,140+
$3.95482
Exquisite packaging
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Alliance Memory, Inc. AS4C64M16D3B-12BIN is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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AS4C64M16D3B-12BIN

AS4C64M16D3B-12BIN

$7.75

Product details

Discover the AS4C64M16D3B-12BIN by Alliance Memory, Inc., a high-efficiency memory IC engineered for next-generation computing platforms. This innovative solution delivers superior performance metrics, combining speed, capacity, and power optimization in a single package. Its architecture is tailored for both embedded and expandable memory applications. The AS4C64M16D3B-12BIN features include dynamic frequency scaling, bank interleaving support, and thermal throttling capability. These advanced features enable optimal performance across various operating conditions. The memory IC offers excellent signal integrity at high speeds while maintaining low power consumption. Its design incorporates reliability enhancements for continuous operation. Ideal applications include hyperscale data centers, AI inference accelerators, and autonomous mobile robots. The AS4C64M16D3B-12BIN is equally effective in virtual reality systems, genomic sequencing equipment, and quantum computing interfaces. Its capabilities extend to smart agriculture systems and renewable energy management platforms requiring high-performance memory solutions. To learn more about integrating this Alliance Memory, Inc. memory IC into your design, submit your inquiry through our online portal. Our application engineers will provide technical support and procurement options for the AS4C64M16D3B-12BIN, ensuring optimal memory performance for your specific requirements.

General specs

  • Product Status: Active
  • Memory Type: Volatile
  • Memory Format: DRAM
  • Technology: SDRAM - DDR3
  • Memory Size: 1Gb (64M x 16)
  • Memory Interface: Parallel
  • Clock Frequency: 800 MHz
  • Write Cycle Time - Word, Page: 15ns
  • Access Time: 20 ns
  • Voltage - Supply: 1.425V ~ 1.575V
  • Operating Temperature: -40°C ~ 95°C (TC)
  • Mounting Type: Surface Mount
  • Package / Case: 96-TFBGA
  • Supplier Device Package: 96-FBGA (9x13)

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