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2299-6321-9UA-1902

3M
2299-6321-9UA-1902 Preview
3M
GRID ZIP 21 X 21
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3M 2299-6321-9UA-1902 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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2299-6321-9UA-1902

2299-6321-9UA-1902

$0.00

Product details

Maximize your electronic system's potential with the 2299-6321-9UA-1902 from 3M, a premium-quality socket designed for ICs and transistors. This socket combines advanced materials with precision engineering to deliver unmatched performance in compact packages. Its innovative contact design ensures reliable connections through thousands of insertion cycles, reducing maintenance needs and total cost of ownership. The 2299-6321-9UA-1902 features excellent EMI shielding properties, making it ideal for sensitive applications in medical imaging, avionics, and satellite communications. With its wide operating temperature range and resistance to environmental stressors, this socket performs flawlessly in both indoor and outdoor installations. The tool-less design allows for quick component swaps, significantly improving production efficiency. Trusted by engineers worldwide, 3M's 2299-6321-9UA-1902 represents the gold standard in interconnect solutions. From prototype development to mass production, this socket adapts to your evolving needs. Take advantage of our expertise contact us now to discuss how the 2299-6321-9UA-1902 can enhance your product's reliability and performance.

General specs

  • Product Status: Obsolete
  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 299 (21 x 21)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30.0µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyethersulfone (PES)
  • Operating Temperature: -55°C ~ 150°C

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