228-4817-00-0602J
3M
3M
CONN IC DIP SOCKET ZIF 28POS GLD
$29.53
Available to order
Reference Price (USD)
1+
$23.22000
10+
$20.96200
25+
$20.08320
50+
$18.82800
100+
$18.20040
250+
$17.19624
500+
$16.69416
Exquisite packaging
Discount
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3M 228-4817-00-0602J is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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228-4817-00-0602J
$29.53
Product details
Experience superior connectivity with the 228-4817-00-0602J from 3M, a high-grade socket specifically designed for ICs and transistors. This socket delivers exceptional electrical performance and mechanical stability, ensuring uninterrupted operation in even the most challenging environments. Its advanced contact technology guarantees low insertion force and high retention, protecting your components during installation and use. The 228-4817-00-0602J stands out with its resistance to vibration, temperature fluctuations, and chemical exposure, making it suitable for automotive control systems, industrial machinery, and IoT devices. The socket's innovative design allows for quick component changes, significantly reducing assembly time. Backed by 3M's quality assurance, the 228-4817-00-0602J meets the highest industry standards for reliability and performance. Whether you're developing new products or maintaining existing systems, this socket offers the perfect balance of functionality and durability. Ready to source this essential component? Submit your inquiry now and our team will provide customized solutions for your specific requirements.
General specs
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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