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224-5248-00-0602J

3M
224-5248-00-0602J Preview
3M
CONN IC DIP SOCKET ZIF 24POS GLD
$30.66
Available to order
Reference Price (USD)
1+
$24.11000
10+
$21.76300
25+
$20.85120
50+
$19.54800
100+
$18.89640
250+
$17.85384
500+
$17.33256
Exquisite packaging
Discount
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EMS 3-7 days

3M 224-5248-00-0602J is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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224-5248-00-0602J

224-5248-00-0602J

$30.66

Product details

The 224-5248-00-0602J by 3M is a versatile socket solution tailored for ICs and transistors, offering unmatched flexibility and performance. Designed with precision in mind, this socket ensures perfect alignment and contact with your components, eliminating connectivity issues. Its compact form factor makes it suitable for space-constrained applications without sacrificing functionality. The 224-5248-00-0602J boasts features like enhanced shock resistance, low contact resistance, and superior mating cycles, ensuring longevity in harsh conditions. Ideal for use in renewable energy systems, robotics, and defense electronics, this socket provides the reliability needed for mission-critical operations. Engineers appreciate its ease of integration and consistent performance across various operating temperatures. With 3M's reputation for excellence, the 224-5248-00-0602J is a smart investment for any high-tech application. Take the next step in optimizing your designs contact us today for more information and pricing details on this exceptional socket solution.

General specs

  • Product Status: Active
  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Connector
  • Features: Closed Frame
  • Termination: Press-Fit
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30.0µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Operating Temperature: -55°C ~ 125°C

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