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200-6311-9UN-1900

3M
200-6311-9UN-1900 Preview
3M
CONN SOCKET PGA ZIF 121POS GOLD
$53.86
Available to order
Reference Price (USD)
1+
$42.77000
10+
$40.25600
25+
$38.99800
50+
$36.48200
100+
$34.46920
250+
$33.46280
Exquisite packaging
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TNT 2-6 days
EMS 3-7 days

3M 200-6311-9UN-1900 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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200-6311-9UN-1900

200-6311-9UN-1900

$53.86

Product details

The 200-6311-9UN-1900 by 3M delivers precision connectivity for ICs and transistors in compact, high-density applications. This innovative socket features micro-precision contacts that maintain excellent electrical characteristics even after thousands of mating cycles. Its low-profile design makes it perfect for space-constrained applications in mobile devices, wearable technology, and miniaturized industrial controls. The 200-6311-9UN-1900 offers superior resistance to mechanical stress and thermal cycling, ensuring reliable performance in challenging conditions. Engineers appreciate its compatibility with automated assembly processes, reducing production time and costs. This socket finds ideal applications in smart home devices, portable medical equipment, and drone technology where size and reliability are critical factors. 3M's quality control processes guarantee consistent performance across all production batches, giving you peace of mind for your high-volume requirements. The 200-6311-9UN-1900 represents the perfect marriage of miniaturization and robustness in interconnect solutions. Don't let space limitations compromise your design explore how this advanced socket can solve your connectivity challenges. Request a quote today to start your evaluation process.

General specs

  • Product Status: Obsolete
  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 121 (11 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30.0µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyethersulfone (PES)
  • Operating Temperature: -55°C ~ 150°C

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