Infineon and Visteon collaborate on power conversion systems for EVs 2025-05-12 Infineon Technologies AG of Munich, Germany and automotive cockpit electronics supplier Visteon Corp of Van Buren Township, MI, USA have signed a memorandum of understanding (MOU) to advance the development of next-generation electric vehicle powertrains.
Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demos record low insertion loss at frequencies up to 325GHz 2025-05-28 At the IEEE’s 75th Electronic Components and Technology Conference (ECTC 2025) in Dallas, TX, USA (27–30 May), nanoelectronics research center imec of Leuven.
