Infineon Introduces CoolSiC™ JFETs to Power the Future of Solid-State Distribution Systems

To support the evolution of next-generation solid-state power distribution systems, Infineon Technologies AG is enhancing its silicon carbide (SiC) product portfolio with the introduction of the CoolSiC™ JFET product family. These new devices are engineered to deliver ultra-low conduction losses, robust turn-off performance, and exceptional durability, positioning them as optimal solutions for advanced solid-state protection and power distribution applications.

With superior short-circuit resilience, stable thermal behavior in linear operating conditions, and precise overvoltage handling, CoolSiC JFETs offer dependable and energy-efficient system performance across a wide array of industrial and automotive uses. Target applications include solid-state circuit breakers (SSCBs), hot-swapping in AI data centers, electronic fuses (eFuses), motor soft starters, industrial safety relays, and automotive battery disconnect systems.

The initial generation of CoolSiC JFETs features extremely low on-resistance values, starting at just 1.5 mΩ for 750 V breakdown voltage (V_BDSS) and 2.3 mΩ for 1200 V—dramatically reducing conduction losses. Optimized with a bulk-channel SiC structure, the devices demonstrate high resilience under both short-circuit and avalanche conditions. Packaged in a top-side cooled Q-DPAK, the JFETs are designed for simple paralleling and scalable current management, enabling compact, high-density power systems with versatile integration possibilities. Their consistent switching characteristics under thermal stress, overloads, and fault scenarios provide maximum reliability for continuous operation in demanding environments.

To overcome the thermal and mechanical challenges typical of harsh industrial and automotive conditions, the CoolSiC JFETs incorporate Infineon’s advanced .XT interconnection technology, featuring diffusion soldering. This significantly enhances thermal performance by reducing transient thermal impedance and improving durability under pulsed and cyclical loads, common in modern power switching applications. Qualified through real-world validation for solid-state switching environments, and built around the industry-standard Q-DPAK package, the devices offer a fast-track path to system integration in both automotive and industrial domains.