Flex Power Modules Introduces BMR323: High-Efficiency, Compact Intermediate Bus Converter for AI and Cloud Power Systems

Flex Power Modules has introduced the BMR323, a next-generation non-isolated, unregulated Intermediate Bus Converter (IBC) engineered to support the increasingly low-voltage, high-power requirements of advanced AI systems and cloud computing infrastructures.

Capable of delivering up to 1.2 kW peak power with an impressive peak efficiency of 97.8%, the BMR323 outperforms its predecessor, the BMR320, by offering more than 60% additional power output while retaining full footprint compatibility. This enables design teams to seamlessly upgrade existing systems to handle higher continuous and peak power demands without requiring substantial redesign.

Optimized for high power density and cost-efficient deployment, the BMR323 delivers 600 W of continuous output power. For scalable systems, up to six modules can be paralleled, achieving a total output of up to 3.6 kW, with active current sharing mechanisms in place to maintain balanced load distribution and ensure system stability.

Operating from a 40–60 V input, the module provides an unregulated output range of 5–7.5 V, and is housed in a compact 1.06 × 0.71 × 0.26 inch (27.0 × 18.0 × 6.7 mm) form factor, making it particularly well-suited for space-constrained high-performance electronics.

The BMR323 is fully compatible with Flex Power Designer, a robust software suite offering design configuration, real-time performance simulation, and monitoring tools through a PMBus® interface. The software is available for free download at www.flexpowerdesigner.com, enabling engineers to efficiently optimize and manage power delivery in complex systems.

A key innovation in the BMR323 is its hybrid switching capacitor (HSC) topology, which, combined with an open-frame construction, significantly enhances thermal performance. These features enable more efficient cooling and support higher output power levels. While the module is optimized for use with a top-mounted heatsink, it is also adaptable to alternative cooling solutions—including direct-to-chip liquid cooling—providing design flexibility in high-performance environments. Compliant with the IEC/EN/UL 62368-1 safety standards, the BMR323 also supports Pb-free SMD reflow soldering processes, making it suitable for lead-free manufacturing and high-temperature soldering profiles required in modern production environments.