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XC3S1400AN-5FGG676C

AMD Xilinx
XC3S1400AN-5FGG676C Preview
XC3S1400AN-5FGG676C Preview
XC3S1400AN-5FGG676C
XC3S1400AN-5FGG676C
AMD Xilinx
IC FPGA 502 I/O 676FBGA
$282.80
Available to order
Reference Price (USD)
1+
$113.82000
Exquisite packaging
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AMD Xilinx XC3S1400AN-5FGG676C is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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XC3S1400AN-5FGG676C

XC3S1400AN-5FGG676C

$282.80

Product details

Engineered for versatility, the XC3S1400AN-5FGG676C FPGA by AMD Xilinx delivers exceptional performance in embedded systems. This FPGA is designed to handle complex algorithms and high-speed data processing with ease. Its modular architecture allows for easy upgrades and modifications, ensuring future-proof solutions. The XC3S1400AN-5FGG676C features a rich set of programmable resources, including DSP blocks and memory elements, to support a variety of applications. With its low-latency design, it is perfect for real-time processing tasks. Industries benefiting from this FPGA include medical devices, where it enables precise imaging and diagnostics, consumer electronics for high-definition video processing, and energy management systems for smart grid applications. The FPGA s robust design ensures reliable operation in harsh environments, making it suitable for oil and gas exploration equipment. Its energy-efficient operation reduces overall system power consumption, contributing to greener solutions. Discover how the XC3S1400AN-5FGG676C can enhance your next project by contacting our sales team for a customized quote.

General specs

  • Product Status: Active
  • Number of LABs/CLBs: 2816
  • Number of Logic Elements/Cells: 25344
  • Total RAM Bits: 589824
  • Number of I/O: 502
  • Number of Gates: 1400000
  • Voltage - Supply: 1.14V ~ 1.26V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)

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