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SIP050-1X18-160BLF

Amphenol ICC (FCI)
SIP050-1X18-160BLF Preview
Amphenol ICC (FCI)
CONN SOCKET SIP 18POS GOLD
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Amphenol ICC (FCI) SIP050-1X18-160BLF is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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SIP050-1X18-160BLF

SIP050-1X18-160BLF

$0.00

Product details

Enhance your electronic designs with the SIP050-1X18-160BLF from Amphenol ICC (FCI), a versatile socket solution for ICs and transistors across various industries. This socket stands out with its multi-point contact system that distributes current evenly, preventing hot spots and ensuring long-term reliability. The SIP050-1X18-160BLF features a unique spring-loaded mechanism that accommodates component tolerances while maintaining consistent contact pressure. Its wide applicability spans from consumer audio equipment to industrial process controls and scientific instrumentation. The socket's material selection focuses on minimizing outgassing, making it suitable for vacuum environments and cleanroom applications. With Amphenol ICC (FCI)'s decades of experience in interconnect solutions, the SIP050-1X18-160BLF incorporates best practices in durability, ease of use, and performance optimization. Special versions are available for high-voltage applications and extreme temperature operations. This socket's design facilitates both manual and automated installation processes, adapting to your production needs. As electronic systems grow more complex, trust the SIP050-1X18-160BLF to provide the reliable foundation your components deserve. Contact our technical experts today to discuss your specific requirements and discover the full potential of this exceptional socket solution.

General specs

  • Product Status: Obsolete
  • Type: SIP
  • Number of Positions or Pins (Grid): 18 (1 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200.0µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -

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